- Improvement of Pot Life in the Epoxy Resin-based Adhesive Formulation by Size Control and Coating of Curing Accelerator Powders
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Jun-Sik Lee, Chang-Yong Hyun, Jong-Hyun Lee
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J Korean Powder Metall Inst. 2008;15(2):119-124.
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DOI: https://doi.org/10.4150/KPMI.2008.15.2.119
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 Abstract
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- To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.
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